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Excellent positioning tolerances: Accumulative pitch deviation or absolute grid failure down to ±0.250 μm, even for 48CH, 96CH, or higher, thanks to processing all V-Grooves across the full wafer width simultaneously.
Advanced V-Groove structuring: New flexibility to simultaneously implement different pitches and shapes (V, U, convex, concave, freeform) within the same array.
Integrated mechanical positioning features: Enables passive alignment and precise assembly.
Full wafer-level testing: 100% of critical-to-performance parameters qualified by tactile geometry and contact position measurements, including fiber circle center analysis.
Various performance levels: Standard accuracy and high-accuracy levels deliverable depending on customer demand.
Proven production platform: Robust and highly scalable manufacturing base with 20+ years of experience in high-volume optics.
Key Specifications
Part No.
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Product Code
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Material
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Channels
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Pitch
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Opening Angle
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Dimensions
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Download |
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| V-groove array | ZLA004927 * | Silicon | 36 | 127 ± 0.35 μm | 90° | 5.0 x 5.0 x 0.68 mm |
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| V-groove array | ZLA004926 * | BF33 | 36 | 127 ± 0.35 μm | 90° | 5.0 x 5.0 x 0.68 mm |
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| V-groove array | ZLA004574 * | BF33 | 16 | 250 ± 0.5 μm | 60° | 6.675 x 4.8 x 1.0 mm |
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